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IPC新发布标准

IPC-9241 Guidelines for Microsection Preparation

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.


IPC-2581B-WAM1 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines. The B1 revision brings the document into agreement with the schema and has added several new specification types. 236 pages. Released December 2016.


J-STD-046 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.


J-STD-609B Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:

  • Those assemblies that are assembled with lead-containing or lead-free solder;
  • Components that have lead-containing or lead-free second level interconnect terminal finishes and materials;
  • The maximum component temperature not to be exceeded during assembly or rework processing;
  • The base materials used in the PCB construction, including those PCBs that use halogen-free resin;
  • The surface finish of PCBs; and
  • The conformal coating on PCBAs.

IPC-1782 Standard for Manufacturing and Supply Chain Traceability of Electronic Products

The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk as agreed between user and supplier (AABUS). This standard applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as, mechanical assembly.

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