This is one of the first IPC standards developed in China. The purpose of this standard is to define the characterization, quality conformance and performance testing of solder dross reduction chemicals for application on the surface of molten solder.
This is one of the first IPC standards developed in China. It is formulated for establishing wording, definitions and testing and certification methods for automated optical inspection (AOI) equipment. It also provides users with measurement system analysis for acceptance methods and acceptability criteria of AOI equipment.
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures. Over 300 pages. Released January 2017.
This is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines. The B1 revision brings the document into agreement with the schema and has added several new specification types. 236 pages. Released December 2016.