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IPC新发布标准

IPC-7535 Solder Dross Reduction in Wave Soldering Process 锡渣抗氧化还原剂要求

This is one of the first IPC standards developed in China. The purpose of this standard is to define the characterization, quality conformance and performance testing of solder dross reduction chemicals for application on the surface of molten solder.

这是首次在中国开发的 IPC标准之一。本标准的目的是定义了用于熔融焊料表面的焊渣抗氧化还原剂的的特征、质量控制和性能测试。


IPC-9262 Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定

This is one of the first IPC standards developed in China. It is formulated for establishing wording, definitions and testing and certification methods for automated optical inspection (AOI) equipment. It also provides users with measurement system analysis for acceptance methods and acceptability criteria of AOI equipment.

这是首次在中国开发的 IPC标准之一。

它被制定用于建立自动光学检查(AOI)设备的措辞,定义和测试及认证方法。它还为用户提供了AOI设备的验收方法和可接受性标准的测量系统分析。


IPC-7711/21C Rework, Modification and Repair of Electronic Assemblies

This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures. Over 300 pages. Released January 2017.


IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies

This is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.


IPC-9241 Guidelines for Microsection Preparation

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.


IPC-2581B-WAM1 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines. The B1 revision brings the document into agreement with the schema and has added several new specification types. 236 pages. Released December 2016.

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