IPC标准开发状况

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想知道你所使用的标准是如何开发的吗?你想帮助让这些标准变得更好吗?你想知道为什么标准中包含某一准则吗?

你的专业技术能改善IPC标准。委员会可以通过电话或邮件开展会议,因此距离不再是问题。实际上,IPC欢迎全球的参与。

参与委员会能提高你的协商和表达技巧。你自己也将从与同行专家的交流中受益。此外,参与委员会能帮助你增加个人履历并获取行业的技术进步的最新信息。

在我们的委员会主页你可以找到更多IPC委员会的信息,同时在标准发展状况网页包含目前正在开发的文档。IPC中国和亚洲的会员受邀参加TGAsia论坛,这是一个标准开发讨论的邮件论坛。如需了解更多关于TGAsia论坛的信息,请联系Harry Han

如果你准备加入我们,请发送一份邮件到Answers@ipc.org。请说明你感兴趣的委员会或技术并提供完整的联系信息,包括你的地址、电话和传真。我们将用最好的方式联系你加入我们。委员会的沟通主要通过电子邮件,因此务必要提供一个工作电子邮件地址。

下面是开发中的IPC文档状况。为了保证正当程序,所有IPC规范说明书在IPC会员公司之间流通,用于审查。如果你想获得一份详细草案,请联系IPC技术人员answers@ipc.org

一经发布,文档可以在我们的在线商店进行购买。

IPC会员在发布日期后90天内可以申请一份新标准。申请请发送至MemberTechRequest@ipc.org

标准化发展状况
新发布标准
IPC-9241 2017年1月 Guidelines for Microsection Preparation
IPC-2581B Am1 2017年1月
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
J-STD-046 2016年11月 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D)
Joint JEDEC/IPC/ECIA
J-STD-609B 2016年11月 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
IPC-1782 2016年11月 Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-2223D 2016年9月 Sectional Design Standard for Flexible Printed Boards
IPC-9252B 2016年9月 Requirements for Electrical Testing of Unpopulated Printed Boards
Supersedes IPC-9252A:2008
IPC-D-640 2016年9月 Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-9691B 2016年9月 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
Supersedes IPC-9691A:2007
IPC-6018C 2016年7月 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
新翻译标准
IPC-A-600J-DE 2017年1月 Abnahmekriterien für Leiterplatten (德语)
IPC-6012D-SP 2016年12月 Clasificación y especificación de rendimiento para los tableros impresos rígidos (西班牙语)
J-STD-001F-AM1-RO 2016年11月 Cerințe pentru Ansamblurile Electrice și Electronice Lipite (罗马尼亚语)
IPC-A-610F-AM1-RO 2016年11月 Acceptabilitatea Ansamblurilor Electronice Amendament 1 (罗马尼亚语)
J-STD-001FS-CN 2016年11月 焊接的电气和电子组件要求航天应用电子部件补充标准 (中文)
IPC-A-610F-AM1-CN 2016年11月 电子组件的可接受性 修订本1 (中文)
IPC-6012DA-CN 2016年11月 刚性印制板的鉴定及性能规范汽车要求附件 (中文)
IPC-6012DS-SP 2016年11月 Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de rendimiento para los tableros impresos rígidos. (西班牙语)
IPC-7530-CN 2016年11月 群焊工艺温度曲线指南(再流焊和波峰焊) (中文)
J-STD-001F-TR 2016年11月 Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri (土耳其语)
IPC-A-610F-TR 2016年11月 Ek1'i içerir (土耳其语)
IPC-A-600J-CN 2016年11月 印制板的可接受性 (中文)
IPC-A-600J-FR 2016年9月 Acceptabilité des Circuits Imprimés (法语)
IPC-T-50M-CN 2016年9月 电子电路互连与封装术语及定义 (中文)
最终草案供行业审核
J-STD-001FS AM 1   Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC-1401   Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry
IPC-7091   Design and Assembly Process Implementation of 3D Components
IPC-7530A   Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-9111   Troubleshooting for Printed Board Assembly Processes
标准提案供投票表决
IPC-A-610FC   IPC-A-610FC Telecom Addendum
IPC/WHMA-A-620C   Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-640   Requirements and Acceptance for Optical Fiber Terminations, Cable/Harness Assemblies and Installation
IPC-1072 Am 1   Intellectual Property Protection in Electronic Assembly Manufacturing - Amendment 1
IPC-1755 Am 2   Conflict Minerals Data Exchange Standard
IPC-7535CN   Solder Dross Reduction in Wave Soldering Process
IPC-7711/21C   Rework, Modification and Repair of Electronic Assemblies
IPC-9204   Guideline on Test Methods for Printed Electronics
IPC-9262CN   Automatic Optical Inspection Characterization and Verification
标准草案
J-STD-001G   Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK-005A   Guide to Solder Paste Assessment
J-STD-006C AM 1   Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-A-610G   Acceptability of Electronic Assemblies
IPC-HDBK-620   Cable and Wire Harness Design Guideline
IPC-CC-830C   Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C   Generic Standard on Printed Board Design
IPC-2231   Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A   Requirements for Printed Electronics Functional Materials
IPC/JPCA-4921A   Requirements for Printed Electronics Base Materials
IPC-6012D MBB Addendum   Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013D   Qualification and Performance Specification for Flexible Printed Boards
IPC-7093A   Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7095D   Design and Assembly Process Implementation for BGAs
IPC-7251   Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A   Stencil and Misprinted Board Cleaning Handbook
IPC-7621   Low Pressure Molding Design, Selection, and Application Guidelines
项目通过
IPC-7621   Low Pressure Molding Design, Selection, and Application Guidelines
IPC-1754   Materials Declaration Standard for Aerospace and Defense
IPC-2201   Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2228   Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292   Sectional Design Standard for Printed Electronics (Additive Circuitry)
IPC-2611A   Generic Requirements for Electronic Product Documentation
IPC-2612A   Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A   Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557   Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC/SGIA-5222   Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6902   Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-6903A   Terms and Defintions for Design, Production and Performance of Printed Electronics
IPC-7070   Guidelines for Printed Board Component Mounting
IPC-7094A   Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC7351C   Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC/JEDEC-9301   Reliability and Design Finite Element Analysis Standard
撤消
     
测试方法提案

2.1 - 视觉测试方法

TM 2.1.7.2   Determining a Weave as Spread Glass

2.2 - 物理量纲测试方法

TM 2.2.14A   Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A   Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A   Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A   Determination of Maximum Solder Powder Particle Size
TM 2.2.20A   Solder paste Metal Content by Weight

2.3 - 化学测试方法

TM 2.3.13 2013年6月 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20   Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1   Stripping Gold from Nickel with ENIG Surface Finish
Tm 2.3.32E   Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E   Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B   Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43   Standard Test Method for Evaluation of Material Compatibility, Cleaning
TM 2.3.44 2015年8月 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry

2.4 - 机械测试方法

TM 2.4.34A   Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A   Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A   Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A   Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A   Solder Paste – Slump Test
TM 2.4.43A   Solder Paste - Solder Ball Test
TM 2.4.45A   Solder Paste – Wetting Test

2.5 - 电气测试方法

TM 2.5.35   Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

2.6 - 环境测试方法

TM 2.6.3.6A   Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A   Surface Insulation Resistance
TM 2.6.14.1A   Electrochemical Migration Resistance Test
TM 2.6.15D   Corrosion, Flux
通过批准的测试方法

声明:中文标准名称以最终发布的中文标准为准!