IPC标准开发状况

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想知道你所使用的标准是如何开发的吗?你想帮助让这些标准变得更好吗?你想知道为什么标准中包含某一准则吗?

你的专业技术能改善IPC标准。委员会可以通过电话或邮件开展会议,因此距离不再是问题。实际上,IPC欢迎全球的参与。

参与委员会能提高你的协商和表达技巧。你自己也将从与同行专家的交流中受益。此外,参与委员会能帮助你增加个人履历并获取行业的技术进步的最新信息。

在我们的委员会主页你可以找到更多IPC委员会的信息,同时在标准发展状况网页包含目前正在开发的文档。IPC中国和亚洲的会员受邀参加TGAsia论坛,这是一个标准开发讨论的邮件论坛。如需了解更多关于TGAsia论坛的信息,请联系Harry Han

如果你准备加入我们,请发送一份邮件到Answers@ipc.org。请说明你感兴趣的委员会或技术并提供完整的联系信息,包括你的地址、电话和传真。我们将用最好的方式联系你加入我们。委员会的沟通主要通过电子邮件,因此务必要提供一个工作电子邮件地址。

下面是开发中的IPC文档状况。为了保证正当程序,所有IPC规范说明书在IPC会员公司之间流通,用于审查。如果你想获得一份详细草案,请联系IPC技术人员answers@ipc.org

一经发布,文档可以在我们的在线商店进行购买。

IPC会员在发布日期后90天内可以申请一份新标准。请登录:http://www.ipc.org/free-member-docs

标准化发展状况
新发布标准
J-STD-001GS 2018年4月 Aerospace and Defense Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
IPC-2292 2018年3月 Design Standard for Printed Electronics on Flexible Substrates
IPC-6903A 2018年3月 Terms and Definitions for the Design and Manufacture of Printed Electronics
IPC-7094A 2018年3月 Design and Assembly Process Implementation for Flip Chip and Die-Size Components
IPC-7621 2018年3月 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-4591A 2018年2月 Requirements for Printed Electronics Functional Conductive Materials
IPC-DRM-PTH-G 2018年2月 Through Hole Solder Joint Evaluation Training & Reference Guide
IPC-DRM-SMT-G 2018年2月 Surface Mount Solder Joint Evaluation Training & Reference Guide
IPC-DRM-18J 2018年2月 Component Identification Training and Reference Guide
J-STD-006C AM 1 2017年11月 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
J-STD-001G 2017年10月 Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610G 2017年10月 Acceptability of Electronic Assemblies
IPC-9505 2017年10月 Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
IPC-6012D Am1 2017年10月 Qualification and Performance Specification for Rigid Printed Boards
新翻译标准
IPC-A-610G-HU 2018年4月 Elektronikai szerelvények elfogadhatósága (匈牙利语)
IPC-A-610G-SP 2018年4月 Aceptabilidad de ensambles electrónicos (西班牙语)
J-STD-001G-CN 2018年4月 焊接的电子和电子组件要求 (中文)
IPC-A-610G-CN 2018年4月 电子组件的可接受性 (中文)
IPC-7527-CN 2018年4月 焊膏印刷要求 (中文)
IPC-7801-CN 2018年4月 再流焊炉工艺控制标准 (中文)
J-STD-001G-EE 2018年3月 Nõuded joodetud elektri- ja elektroonikakoostudele (爱沙尼亚语)
IPC/WHMA-A-620C-JP 2018年3月 ケーブル・ワイヤーハーネス組立の要求事項及び許容基準 (日语)
IPC-7711/21C-DE 2018年1月 Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen (德语)
IPC-7711/21C-SP 2018年1月 Reparación, Modificación y Reparación de Ensambles Electrónicos (西班牙语)
IPC/WHMA-A-620C-SP 2017年10月 Requisitos y Aceptabilidad de Cables y Mazos de Cables (西班牙语)
最终草案供行业审核
J-STD-001G Am1   Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK-620   Cable and Wire Harness Design Guideline
IPC/WHMA-A-620C-S
  Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C
IPC-1754   Materials Declaration Standard for Aerospace and Defense
IPC-9111   Troubleshooting for Printed Board Assembly Processes
IPC-9121 Am1   Troubleshooting PCB Fabrication Processes - Amendment 1
标准提案供投票表决
IPC-7095D   Design and Assembly Process Implementation for BGAs
标准草案
IPC-HDBK-005A   Guide to Solder Paste Assessment
IPC-CC-830C   Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C   Generic Standard on Printed Board Design
IPC-2231   Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC-2591   Connected Factory Exchange
IPC/SGIA-5222   Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6012D MBB Addendum   Metal Base Printed Boards Addendum to IPC-6012D
IPC-6012E   Qualification and Performance Specification for Rigid Printed Boards
IPC-6017A   Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
IPC-6902   Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-7093A   Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7251   Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A   Stencil and Misprinted Board Cleaning Handbook
IPC-7991   Process Guideline for 3D Printed Electronics
IPC-9242   Guidelines for Microsection Evaluation
项目通过
J-STD-003C Am2   Solderability Tests for Printed Boards
IPC-SM-840F   Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-1791   Trusted Electronic Designer, Manufacturer, and Assembler Requirements
IPC-2201   Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A   Generic Requirements for Electronic Product Documentation
IPC-2612A   Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A   Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557   Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070   Guidelines for Printed Board Component Mounting
IPC-7351C   Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC/JEDEC-9301   Reliability and Design Finite Element Analysis Standard
撤消
     
测试方法提案

2.1 - 视觉测试方法

TM 2.1.7.2   Determining a Weave as Spread Glass

2.2 - 物理量纲测试方法

TM 2.2.14A   Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A   Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A   Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A   Determination of Maximum Solder Powder Particle Size
TM 2.2.20A   Solder paste Metal Content by Weight

2.3 - 化学测试方法

TM 2.3.13 2013年6月 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20   Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1   Stripping Gold from Nickel with ENIG Surface Finish
Tm 2.3.32E   Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E   Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B   Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43   Standard Test Method for Evaluation of Material Compatibility, Cleaning

2.4 - 机械测试方法

TM 2.4.34A   Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A   Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A   Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A   Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A   Solder Paste – Slump Test
TM 2.4.43A   Solder Paste - Solder Ball Test
TM 2.4.45A   Solder Paste – Wetting Test

2.5 - 电气测试方法

TM 2.5.35   Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

2.6 - 环境测试方法

TM 2.6.3.6A   Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A   Surface Insulation Resistance
TM 2.6.14.1A   Electrochemical Migration Resistance Test
TM 2.6.15D   Corrosion, Flux
已通过的测试方法

2.3 - 化学测试方法

TM 2.3.44 2017年11月 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry

2.4 - 机械测试方法

TM 2.4.25D 2017年11月 Glass Transition Temperature and Cure Factor by DSC

声明:中文标准名称以最终发布的中文标准为准!