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《电子设备用电感器的测试方法和试验程序》标准开发技术组成员招募

针对应用在设备上的电感器,使用者目前无法找到一份较为全面的标准方法对电感器进行试验。为了让电感制造加工方、测试机构及终端使用者能够拥有一份全面有效的试验方法或试验程序,IPC目前正在全球范围内召集业界专家来共同开发《电子设备用电感器的测试方法和试验程序》标准。标准已经申请立项成功,主席为伍尔特电子eiSos集团的Thomas Brander。请符合报名条件且有意向参加的专家们在11月30日18:00前报名。

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IPC标准开发状况

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在我们的委员会主页你可以找到更多IPC委员会的信息,同时在标准发展状况网页包含目前正在开发的文档。IPC中国和亚洲的会员受邀参加TGAsia论坛,这是一个标准开发讨论的邮件论坛。如需了解更多关于TGAsia论坛的信息,请联系Harry Han

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标准化发展状况
新发布标准
IPC-6012D Am1 2017年10月 Qualification and Performance Specification for Rigid Printed Boards
IPC-7091 2017年9月 Design and Assembly Process Implementation of 3D Components
IPC-6013D 2017年9月 Qualification and Performance Specification for Flexible Printed Boards
IPC-4552A 2017年8月 Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
IPC-A-640 2017年7月 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
IPC-4921A 2017年6月 Requirements for Printed Electronics Base Materials
IPC-1755-WAM1&2 2017年5月 Conflict Minerals Data Exchange Standard - with Amendments 1 & 2
IPC-7530A 2017年4月 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-4101E 2017年4月 Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-1401 2017年4月 Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry
新翻译标准
IPC/WHMA-A-620C-DE 2017年8月 Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen
IPC-7525B-RU 2017年8月 Руководство по конструированию трафаретов
IPC-6012DS-CN 2017年8月 刚性印制板的鉴定及性能规范航天和军事航空电子应用补充标准
IPC-7711/7721C-CN 2017年7月 电子组件的返工、修改和维修
J-STD-001F-AM1-FR 2017年6月 Exigences des Assemblages Électriques et Électroniques Brasés (法语)
IPC-A-610F-AM1-FR 2017年6月 Acceptabilité des Assemblages Électroniques (法语)
IPC-1401-CN 2017年4月 供应链社会责任管理体系指南 (中文)
IPC-7095C-CN 2017年4月 BGA设计与组装工艺的实施 (中文)
J-STD-001F-WAM1-CN 2017年4月 焊接的电气和电子组件要求修订版F附修订本1 (中文)
IPC/WHMA-A-620B-S-CN
2017年4月 IPC/WHMA-A-620B航天应用电子部件补充标准 (中文)
最终草案供行业审核
IPC-7095D   Design and Assembly Process Implementation for BGAs
IPC-9111   Troubleshooting for Printed Board Assembly Processes
标准提案供投票表决
J-STD-001G   Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610G   Acceptability of Electronic Assemblies
IPC-HDBK-620   Cable and Wire Harness Design Guideline
IPC-1754   Materials Declaration Standard for Aerospace and Defense
IPC-2226A   Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-2292   Sectional Design Standard for Printed Electronics (Additive Circuitry)
IPC-6903A   Terms and Defintions for Design, Production and Performance of Printed Electronics
IPC-7094A   Design and Assembly Process Implementation for Flip Chip and Die Size Components
标准草案
IPC-HDBK-005A   Guide to Solder Paste Assessment
J-STD-006C AM 1   Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-CC-830C   Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C   Generic Standard on Printed Board Design
IPC-2231   Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A   Requirements for Printed Electronics Functional Materials
IPC-6012D MBB Addendum   Metal Base Printed Boards Addendum to IPC-6012D
IPC-7093A   Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7251   Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A   Stencil and Misprinted Board Cleaning Handbook
IPC-7621   Low Pressure Molding Design, Selection, and Application Guidelines
项目通过
IPC-7621   Low Pressure Molding Design, Selection, and Application Guidelines
J-STD-003C Am2   Solderability Tests for Printed Boards
IPC-2201   Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2228   Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2611A   Generic Requirements for Electronic Product Documentation
IPC-2612A   Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A   Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557   Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC/SGIA-5222   Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6012E   Qualification and Performance Specification for Rigid Printed Boards
IPC-6902   Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-7070   Guidelines for Printed Board Component Mounting
IPC-7351C   Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC/JEDEC-9301   Reliability and Design Finite Element Analysis Standard
撤消
     
测试方法提案

2.1 - 视觉测试方法

TM 2.1.7.2   Determining a Weave as Spread Glass

2.2 - 物理量纲测试方法

TM 2.2.14A   Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A   Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A   Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A   Determination of Maximum Solder Powder Particle Size
TM 2.2.20A   Solder paste Metal Content by Weight

2.3 - 化学测试方法

TM 2.3.13 2013年6月 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20   Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1   Stripping Gold from Nickel with ENIG Surface Finish
Tm 2.3.32E   Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E   Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B   Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43   Standard Test Method for Evaluation of Material Compatibility, Cleaning
TM 2.3.44 2015年8月 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry

2.4 - 机械测试方法

TM 2.4.34A   Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A   Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A   Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A   Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A   Solder Paste – Slump Test
TM 2.4.43A   Solder Paste - Solder Ball Test
TM 2.4.45A   Solder Paste – Wetting Test

2.5 - 电气测试方法

TM 2.5.35   Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

2.6 - 环境测试方法

TM 2.6.3.6A   Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A   Surface Insulation Resistance
TM 2.6.14.1A   Electrochemical Migration Resistance Test
TM 2.6.15D   Corrosion, Flux
通过批准的测试方法

声明:中文标准名称以最终发布的中文标准为准!